Method for producing high resolution etched circuit patterns fro

Details Method for producing high resolution etched circuit patterns fro Method for producing high resolution etched circuit patterns fro

1984-11-09

1987-03-31

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156664, 156902, 252 792, 204 321, B44C 122

Patent

active

046541160

ABSTRACT:
A method for producing high resolution etched circuit patterns from a metal clad laminate of a conductive species on a nonconductive substrate is provided. The laminate is etched with an etchant solution for the conductive species to form a circuit pattern. The etched laminate is contacted with an oxidizing agent and aqueous acid to remove redeposited conductive species from the exposed substrate adjacent the circuit pattern. The side walls of the resulting circuit pattern are substantially vertical and free of "halo".

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patent: 3411965 (1968-11-01), Hobaica
patent: 3653997 (1972-04-01), Rothschild
patent: 3728177 (1973-04-01), Caule
patent: 3955156 (1976-05-01), Fleming
patent: 4046620 (1977-09-01), Andrascek et al.
patent: 4159917 (1979-07-01), Gluck
patent: 4430154 (1984-02-01), Stahl et al.

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