Method for producing epoxy resin composition for...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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C257S793000, C523S466000, C525S481000

Reexamination Certificate

active

11000905

ABSTRACT:
A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

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patent: 6274251 (2001-08-01), Ohashi et al.
patent: 6525160 (2003-02-01), Goda et al.
patent: 6767980 (2004-07-01), Yurugi et al.
patent: 56-45491 (1981-10-01), None
patent: 5-275572 (1993-10-01), None
patent: 6-228280 (1994-08-01), None
patent: 7-35432 (1995-04-01), None
patent: 7-122683 (1995-05-01), None
patent: 9-52228 (1997-02-01), None
patent: 9-216936 (1997-08-01), None

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