Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-09-29
1994-10-25
Beck, Shrive
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
427 58, 427 96, 427 97, 427124, 427264, 427275, 427307, 427556, 204112, 204118, 204261, B05D 100
Patent
active
053586042
ABSTRACT:
The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.
REFERENCES:
patent: 3013913 (1957-08-01), Croop
patent: 3230163 (1966-01-01), Dreyfus
patent: 3324014 (1967-06-01), Modjeska
patent: 4053370 (1977-10-01), Yamashita et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4266006 (1981-05-01), Uhlig et al.
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4403828 (1983-09-01), Davis et al.
patent: 4546065 (1985-10-01), Amendola
patent: 4606787 (1986-08-01), Pelligrino
patent: 4715116 (1987-12-01), Thorpe et al.
patent: 4781991 (1988-11-01), Thorpe et al.
patent: 4790902 (1988-12-01), Wada et al.
patent: 4889584 (1989-12-01), Wada et al.
Hirsch Tom J.
Lee Chung J.
Lin Charles W. C.
Tran Kimcuc T.
Beck Shrive
Dang Vi Duong
Microelectronics and Computer Technology Corp.
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