Method for producing circuit board assemblies using surface moun

Details Method for producing circuit board assemblies using surface moun Method for producing circuit board assemblies using surface moun

1996-04-10

1998-04-21

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361783, 361779, 439 68, 439 83, 174260, 174261, 2281791, 22818021, 22818022, H05K 100

Patent

active

057424837

ABSTRACT:
Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.

REFERENCES:
patent: 4872261 (1989-10-01), Sanyal et al.
patent: 5453582 (1995-09-01), Amano et al.
patent: 5509597 (1996-04-01), Laferriere
patent: 5523920 (1996-06-01), Machuga et al.

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