4. Adhesive bonding and miscellaneous chemical manufacture
  5. Surface bonding means and/or assembly means therefor
  6. With means applying wave energy or electrical energy...

Ping Kwong Seto

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Apparatus for attaching heat sinks directly to chip carrier modu

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent

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Chip carrier modules with heat sinks attached by flexible-epoxy

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Method for attaching heat sinks directly to chip carrier modules

Fishing – trapping – and vermin destroying
Patent

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Method for producing circuit board assemblies using surface moun

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Method for producing circuit board assemblies using surface...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-51664

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