Method for producing chip stacks

Details Method for producing chip stacks Method for producing chip stacks

2007-08-07

2007-08-07

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085, C438S109000, C438S110000

Reexamination Certificate

active

11236311

ABSTRACT:
A plurality of interconnect layers are produced on a top side of one or two semiconductor chips, and are mutually isolated from one another in each case by insulation layers that are patterned in such a way that an interconnect layer applied as bridge makes contact with the interconnects applied previously.

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patent: 2000-228485 (2000-08-01), None
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