Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1999-05-26
2000-10-31
Fiorilla, Christopher A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 8916, 156 8918, 264642, 264672, B32B 3100, C03B 2900
Patent
active
061396664
ABSTRACT:
A method for making multilayer ceramic substrates having substantially reduced planar shrinkage and distortion resulting from the firing or sintering process. Contact sheets are employed in the fabrication process on the surface of the multilayer ceramic substrate to be fired with the contact sheets being prepared from a composition containing a non-sinterable non-metallic inorganic material such as alumina having an average particle size approximately about 1 micron or less and an organic binder and preferably a plasticizer. In a preferred embodiment of the invention, the multilayer structure to be fired containing the contact sheet of the invention is provided with a beveled or chamfered edge at an angle of greater than about 60 degrees. A fabrication process employing only chamfering of the edge or the use of a contact sheet of the invention also provides improved multilayer ceramic substrate products. A further feature is a method to control the surface topography of surface metallization by adjusting the compressibility of the contact sheets during fabrication of the substrate.
REFERENCES:
patent: 2966719 (1961-01-01), Park, Jr.
patent: 3698923 (1972-10-01), Stetson et al.
patent: 4753694 (1988-06-01), Herron et al.
patent: 4756959 (1988-07-01), Ito et al.
patent: 4769294 (1988-09-01), Barringer et al.
patent: 5085720 (1992-02-01), Mikeska et al.
patent: 5130067 (1992-07-01), Flaitz et al.
patent: 5254191 (1993-10-01), Mikeska et al.
patent: 5277723 (1994-01-01), Kodama et al.
patent: 5387474 (1995-02-01), Mikeska et al.
patent: 5502013 (1996-03-01), James
A Cofired Bump Bonding Technique for Chip-Scale-Package Fabrication Using Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate, Minehiro Itagaki, Nobuhiro Hase, Satoru Yuhaku, Yoshihiro Bessho and Kazuo Eda, Matsushita Electric Industrial Co., Ltd. Device Engineering Development Center, 1006, Kadoma, Kadoma-shi, Osaka, 571 Japan, 1997 International Symposium on Microelectronics, pp 685-690.
Fasano Benjamin V.
Indyk Richard F.
Kamath Sundar M.
Langenthal Scott I.
Reddy Srinivasa S.
Ahsan Aziz M.
Fiorilla Christopher A.
International Business Machines - Corporation
Tomaszewski John J.
LandOfFree
Method for producing ceramic surfaces with easily removable cont does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing ceramic surfaces with easily removable cont, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing ceramic surfaces with easily removable cont will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2046774