4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Srinivasa S. Reddy

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Enhanced high-frequency via interconnection for improved...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Method and materials for increasing the strength of...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Method for producing ceramic surfaces with easily removable cont

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Multi-cavity substrate structure for discrete devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Multi-cavity substrate structure for discrete devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1814097

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