Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-27
2010-12-07
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S040000, C257SE21476
Reexamination Certificate
active
07846838
ABSTRACT:
The invention relates to a method for producing an electronic component on a surface of a substrate with the electronic component having, seen at right angles to the surface of the substrate, at least two electrical functional layers which are arranged one above the other and such that they overlap at least in a surface area F, with the at least two electrical functional layers on the substrate being structured directly or indirectly using a continuous process, with a first electrical functional layer of the at least two electrical functional layers being structured such that a first length/width dimension of the first electrical functional layer parallel to the surface of the substrate and in a relative movement direction of the substrate is at least 5 μm longer/wider, preferably more than 1 mm longer/wider, than a length/width dimension of the surface area F in the relative movement direction and parallel to the surface of the substrate.
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Fix Walter
Knobloch Alexander
Ullmann Andreas
Welker Merlin
Brown Valerie
Carella Byrne et al.
Nguyen Ha Tran T
Olstein Elliot M.
Polyic GmbH & Co. KG
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