Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Patent
1995-05-08
1997-08-05
Niebling, John
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
438140, 438542, 438931, 438945, 148DIG126, H01L 21265
Patent
active
056542089
ABSTRACT:
The present invention relates to a method for producing a semiconductor device having a semiconductor layer of SiC. The method comprises the steps of a) applying a mask on at least a portion of the SiC layer to coat a first portion of the SiC layer leaving a second portion thereof uncoated, b) applying a heat treatment to the SiC layer, and c) supplying dopants to the SiC layer during the heat treatment for diffusion of the dopants into the SiC layer at the second portion thereof for doping the SiC layer. The mask is made of crystalline AIN as the only component or AIN as a major component of a crystalline alloy constituting the material.
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patent: 5510632 (1996-04-01), Brown et al.
Campbell et al., Electrical Properties of SiC Devices, in Mat. Res. Bull. vol. 4, pp. S 211-S 222, 1969, month unknown.
Harris Christopher
Janzen Erik
Konstantinov Andrei
ABB Research Ltd.
Booth Richard A.
Niebling John
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