Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-01-30
2008-10-28
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21507
Reexamination Certificate
active
07442635
ABSTRACT:
The present invention is related to a method of producing a semiconductor device and the resulting device. The method is suitable in the first place for producing high power devices, such as High Electron Mobility Transistors (HEMT), in particular HEMT-devices with multiples source-gate-drain groups or multiple base bipolar transistors. According to the method, the interconnect between the source contacts is not produced by air bridge structures, but by etching vias through the semiconductor layer directly to the ohmic contacts and applying a contact layer on the backside of the device.
REFERENCES:
patent: 5162258 (1992-11-01), Lemnios et al.
patent: 5264713 (1993-11-01), Palmour
patent: 5841197 (1998-11-01), Adamic, Jr.
patent: 5919713 (1999-07-01), Ishii et al.
patent: 6214639 (2001-04-01), Emori et al.
patent: 6455945 (2002-09-01), Ishii et al.
patent: 6940144 (2005-09-01), Nakayama
patent: 7217988 (2007-05-01), Ahlgren et al.
patent: 2001/0005043 (2001-06-01), Nakanishi et al.
patent: 2002/0022343 (2002-02-01), Nonaka
patent: 2002/0030267 (2002-03-01), Suzuki
patent: 2003/0024635 (2003-02-01), Utsunomiya
patent: 102 38 444 (2004-03-01), None
patent: 1 255 296 (2002-11-01), None
patent: 2 046 514 (1980-11-01), None
patent: 01 048423 (1989-02-01), None
patent: 02 148739 (1990-06-01), None
patent: 04 116950 (1992-04-01), None
patent: 04 144245 (1992-05-01), None
patent: WO 2004/109770 (2004-12-01), None
patent: WO 2004/109770 (2004-12-01), None
Sheppard, et al. High power demonstration at 10 GHz with GaN/GaN HEMT hybrid amplifliers. Device Research Conference, 2000. Conference Digest. 58th DRC Jun. 19-21, 2000, Piscataway, NJ, USA, IEEE, pp. 37-38. XP010517447.
European Report dated Feb. 6, 2008, for European Application No. EP 06 44 7017 filed Jan. 31, 2006.
Das Johan
Ruythooren Wouter
Interuniversitair Microelektronica Centrum (IMEC)
Knobbe Martens Olson & Bear LLP
Malsawma Lex
LandOfFree
Method for producing a semiconductor device and resulting... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing a semiconductor device and resulting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a semiconductor device and resulting... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3999073