Method for producing a semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156DIG73, C30B 3300

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active

045644160

ABSTRACT:
A method of producing a semiconductor device comprising a semiconductor substrate exhibiting defect density of 10.sup.5 /cm.sup.2 or more when the central portion of the substrate is observed through an optical microscope after the substrate is heat-treated at 1,050.degree. C. for 18 hours and etched along a section thereof across the thickness thereof.

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