Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1981-12-08
1986-01-14
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156DIG73, C30B 3300
Patent
active
045644160
ABSTRACT:
A method of producing a semiconductor device comprising a semiconductor substrate exhibiting defect density of 10.sup.5 /cm.sup.2 or more when the central portion of the substrate is observed through an optical microscope after the substrate is heat-treated at 1,050.degree. C. for 18 hours and etched along a section thereof across the thickness thereof.
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Homma Kazumoto
Watanabe Masaharu
Bernstein Hiram H.
Tokyo Shibaura Denki Kabushiki Kaisha
Toshiba Ceramics Co. Ltd.
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