Method for producing a reliable BGA solder joint interconnection

Metal fusion bonding – Process – With condition responsive – program – or timing control

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228103, B23K 3112

Patent

active

061388939

ABSTRACT:
A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

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