Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1998-06-25
2000-10-31
Ryan, Patrick
Metal fusion bonding
Process
With condition responsive, program, or timing control
228103, B23K 3112
Patent
active
061388939
ABSTRACT:
A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.
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Caletka David V.
Knadle Kevin
Woychik Charles G.
Edmondson L.
International Business Machines - Corporation
Ryan Patrick
LandOfFree
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