Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-06-07
2011-06-07
Smith, Bradley K (Department: 2894)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S109000, C438S111000, C438S112000, C257S666000, C257S672000, C257S674000
Reexamination Certificate
active
07955901
ABSTRACT:
A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.
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Bergmann Robert
Engl Reimund
Ewe Henrik
Goh Soon Lock
Landau Stefan
Choudhry Mohammad
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Smith Bradley K
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