Method for producing a plurality of layers of metallurgy

Details Method for producing a plurality of layers of metallurgy Method for producing a plurality of layers of metallurgy

1988-03-04

1989-02-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156652, 156653, 156656, 156657, 1566591, 1566611, 156668, 20419235, 20419237, 437228, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

048056839

ABSTRACT:
A method for selectively depositing a plurality of metal layers on a substrate. The method includes the steps of depositing at least one layer of blanket metal on a surface of a substrate, building a lift-off stencil over the blanket metal, depositing at least one layer of redundant metal over the lift-off stencil, depositing a first etch-resistant barrier over the redundant metal, removing the lift-off stencil and the overlying layers of redundant metal and the etch-resistant barrier, depositing a second etch-resistant barrier over the blanket metal and the first etch-resistant barrier, and then reactive ion etching (RIE) the second etch-resistant barrier so as to expose the blanket metal and at least partially remove the second etch-resistant barrier from the first etch-resistant barrier. A final step of the method includes etching the blanket metal. Also disclosed is a metallurgical structure for a packaging substrate. The metallurgical structure includes layers of blanket metal and redundant metal. The redundant metal has an electrically isolating coating on its side but not on its top surface, thereby facilitating the electrical contact of the redundant metal with an electrical component.

REFERENCES:
patent: 4092442 (1978-05-01), Agnihotri et al.
patent: 4206254 (1980-06-01), Schmeckenbecher
patent: 4221047 (1980-09-01), Narken et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4413061 (1983-11-01), Kumar et al.
patent: 4526859 (1985-07-01), Christensen et al.
"Process for Forming Copper Studs for Metallurgy Systems" by P. M. Schaible et al., IBM Technical Disclosure Bulletin, vol. 27, No. 6, Nov. 1984, pp. 3341-3342.
"Packaging Substrate with Top Surface Metallurgy Adapted for Mixed Technology Device Bonding and Method" by C. R. Fedorko, Jr., et al., IBM Technical Disclosure Bulletin, vol. 26, No. 12, May 1984, p. 6624.

Affiliated with

Also associated with

Rating

Method for producing a plurality of layers of metallurgy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a plurality of layers of metallurgy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a plurality of layers of metallurgy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1515961