Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1991-01-08
1992-09-22
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430314, 430317, 430327, 430331, 427 96, G03C 174
Patent
active
051496151
ABSTRACT:
A method for producing a planar surface on which conductive traces can be formed to fabricate a multi-layer integrated circuit. In this method, a substrate (20) serves as a base for the formation of conductive traces including copper conductors (30). These conductors are preferably bonded to an adhesion layer (22) and coated with a corrosion barrier (31). A first polyimide coating (34) is spin coated over the substrate and the copper conductors, leaving an undulating surface. Portions of the first polyimide coating lying above the copper conductors are removed, and the resulting surface is coated with a second polyimide coating (44). The polyimide comprising the first and second coatings is selected for its characteristic ability to partially dissolve a previously applied layer of the material, so that the two layers combine, thereby leveling out an non-planar irregularities existing in the first layer. The resulting planar surface forms a base for application of subsequently applied copper conductors (54), which are connected to the previously applied copper conductors at vias, photolithographically formed in the second polyimide coating. Additional layers of copper conductors can be applied to the planar surface as the process is repeated.
REFERENCES:
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Chakravorty Kishore K.
Tanielian Minas H.
Duda Kathleen
McCamish Marion E.
The Boeing Company
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