Method for producing a multi-step structure in a substrate

Details Method for producing a multi-step structure in a substrate Method for producing a multi-step structure in a substrate

1996-05-01

1997-06-24

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430317, 430323, 430329, G03F 700

Patent

active

056416105

ABSTRACT:
A structure of openings is produced in two or more layers of silylated, polyimide photoresist. Openings in subsequent layers, which overlap previous openings, are of larger size. Then the structure is transferred to an organic substrate using oxygen plasma etching with up to 3% CF.sub.4. The smallest opening transferred to the substrate extends through the substrate.

REFERENCES:
IBM Technical Disclosure, vol. 32, No. 8A, Jan. 1990, pp. 218-219, "Method to Incorporate Three Sets of Pattern Information in Two Photo-Masking Steps".

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