Method for producing a multi-chip circuit module including a...

Details Method for producing a multi-chip circuit module including a... Method for producing a multi-chip circuit module including a...

2005-07-19

2005-07-19

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S124000, C438S622000

Reexamination Certificate

active

06919226

ABSTRACT:
A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.

REFERENCES:
patent: 3862017 (1975-01-01), Tsunemitsu et al.
patent: 5151388 (1992-09-01), Bakhit et al.
patent: 6110806 (2000-08-01), Pogge
patent: 6184143 (2001-02-01), Ohashi et al.
patent: 6365438 (2002-04-01), Ishida et al.
patent: 2000-299428 (2000-10-01), None
patent: 2001-168269 (2001-06-01), None
patent: 2001-291819 (2001-10-01), None
patent: 2002-170921 (2002-06-01), None

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