Method for producing a microelectronic sensor

Details Method for producing a microelectronic sensor Method for producing a microelectronic sensor

1996-09-30

2000-12-05

Fourson, George

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 53, H01L 2984, H01L 21311

Patent

active

061565865

ABSTRACT:
The invention relates to a microelectronic integrated sensor, in which a cantilever is formed. To avoid mechanical stress during the production process, the cantilever is disposed freely movably in the sensor. To that end, a support for retaining the cantilever and lateral and upper motion limiters are provided, which prevent the cantilever from slipping off the support. The invention also relates to a method for producing such a sensor.

REFERENCES:
patent: 4882933 (1989-11-01), Petersen et al.
patent: 5121633 (1992-06-01), Murakami et al.
patent: 5157472 (1992-10-01), Takemura
patent: 5181156 (1993-01-01), Gutteridge et al.
patent: 5231879 (1993-08-01), Yamamoto
patent: 5241864 (1993-09-01), Addie et al.
patent: 5258097 (1993-11-01), Mastrangelo
patent: 5265474 (1993-11-01), Chaffin et al.
patent: 5886261 (1999-03-01), Mueller et al.
"Tiny Accelerometer IC reaches High Sensitivity", (Richard Nass), Electronic Design, Sep. 22, 1988, pp. 170-171.

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