Method for producing a microelectronic integrated cantilever

Details Method for producing a microelectronic integrated cantilever Method for producing a microelectronic integrated cantilever

1998-11-19

2000-10-24

Niebling, John F.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 48, 438 50, 257758, 7351436, 156643, H01L 2100

Patent

active

061366315

ABSTRACT:
A microelectronic integrated sensor is formed with a cantilever. For the purpose of ensuring a system which is especially invulnerable to mechanical strains during production, the cantilever is placed freely movably on a support, and motion limiters are provided on the edge. The invention also provides for the formation of nitride pillars for supporting the upper layers, in order to further increase the stability. A corresponding production process for producing the sensor is disclosed as well.

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