Method for producing a metallic pattern upon a substrate

Details Method for producing a metallic pattern upon a substrate Method for producing a metallic pattern upon a substrate

1979-09-28

1981-09-08

Hess, Bruce H.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156634, 156656, 1566591, 156668, 1566611, 428199, 428203, 428209, 430275, 430323, 430328, 430394, B44C 122, C23F 102, H01L 21312

Patent

active

042882826

ABSTRACT:
A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side.

REFERENCES:
patent: 3761264 (1973-09-01), Sterzer
patent: 4171240 (1979-10-01), Wong
patent: 4175963 (1979-11-01), Crivello

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