Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-27
2010-02-09
Tran, Thien F (Department: 2895)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S604000
Reexamination Certificate
active
07659190
ABSTRACT:
A Group III-V compound semiconductor includes, at least, a substrate, a buffer layer of the general formula InuGavAlwN (wherein, 0≦u≦1, 0≦v≦1, 0≦w≦1, u+v+w=1) and a Group III-V compound semiconductor crystal layer of the general formula InxGayAlzN (wherein, 0≦x≦1, 0≦y≦1, 0≦z≦1, x+y+z=1), in this order, wherein the buffer layer has a thickness of at least about 5 Å and not more than about 90 Å. A method is provided for producing the Group III-V compound semiconductor, including forming a buffer layer of the general formula InuGavAlwN on a substrate to give a thickness of at least about 5 Å and not more than about 90 Å at temperatures lower than the growing temperature of the compound semiconductor crystal layer before growing the compound semiconductor crystal layer, and then growing a Group III-V compound semiconductor crystal layer of the general formula InxGayAlzN on the buffer layer.
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Kimura, R., et al., “Molecular Beam Epitaxial Growth of GaN on (0001) AI2O3Using an Ultrathin Amorphous Buffer Layer Deposited at Low Temperature”,Jpn. J. Appl. Phys., vol. 30, pp. 1039-1043 (2000).
Morishima Shin-ichi
Sasaki Makoto
Shimizu Masaya
Panitch Schwarze Belisario & Nadel LLP
Sumitomo Chemical Company Limited
Tran Thien F
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