Method for producing a dielectric material on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S315000, C257SE29165

Reexamination Certificate

active

08049264

ABSTRACT:
Method for producing a dielectric material on a semiconductor device and semiconductor deviceMethod for producing a dielectric material on semiconductor device with an atomic layer deposition procedure, whereby an aluminum oxide nitride or a silicon oxide nitride or an aluminum silicon oxide nitride layer is deposited comprising a rare earth metal-element.The invention describes a semiconductor device with a dielectric layer comprising aluminum oxide nitride or silicon oxide nitride or an aluminum silicon oxide nitride comprising a rare earth metal element.

REFERENCES:
patent: 4894696 (1990-01-01), Takeda et al.
patent: 5986301 (1999-11-01), Fukushima et al.
patent: 6201291 (2001-03-01), Kordic et al.
patent: 6727134 (2004-04-01), Chen et al.
patent: 6833296 (2004-12-01), Yugami et al.
patent: 6844604 (2005-01-01), Lee et al.
patent: 7057227 (2006-06-01), Lee
patent: 2002/0050608 (2002-05-01), Landheer et al.
patent: 2002/0121665 (2002-09-01), Kawasaki et al.
patent: 2003/0186559 (2003-10-01), Kim et al.
patent: 2003/0218170 (2003-11-01), Yamazaki et al.
patent: 2004/0067838 (2004-04-01), Mandal et al.
patent: 2004/0155225 (2004-08-01), Yamada et al.
patent: 2004/0198069 (2004-10-01), Metzner et al.
patent: 2004/0266217 (2004-12-01), Kim et al.
patent: 2005/0040481 (2005-02-01), Shimizu et al.
patent: 2005/0093033 (2005-05-01), Kinoshita et al.
patent: 2005/0161663 (2005-07-01), Atanackovic
patent: 2006/0118890 (2006-06-01), Li
patent: 2004056067 (2004-02-01), None
patent: 1020040002818 (2004-01-01), None
Hyung-Seok Jung et al. ,“Improved Current Performance of CMOSFETs With Nitrogen Incorporated HfO2-Al203Laminate Gate Dielectric,” IEDM Tech. Dig. (2002), pp. 853-856.
Masato Koyama et al., “Effect of Film Composition of Nitrogen Incorporated Hafnium Aluminate (HfAION) Gate Dielectric on Structural Transformation . . . ,” Japanese Journal of Applied Physics, vol. 43, No. 4B, 2004, pp. 1788-1794.
Katsuyuki Sekine et al., “Nitrogen Profile Control by Plasma Nitridation Technique for Poly-Si Gate HfSiON CMOSFET with Excellent . . . ,”IEDM Tech. Dig. (2003), pp. 102-106.
Masahiro Koike et al., “Effect of Hf-N Bond on Properties of Thermally Stable Amorphous HfSiON and Applicability of this Material to . . . ,” IEDM Tech. Dig. (2003), pp. 107-110.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing a dielectric material on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a dielectric material on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a dielectric material on a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4309577

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.