Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2007-11-20
2010-10-12
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C438S783000, C257S702000, C257S793000, C257SE21502, C257SE23002
Reexamination Certificate
active
07811860
ABSTRACT:
A method for producing a device and a device is disclosed. In one embodiment, a component is surrounded by a material. A fluoropolymer-containing compound is produced at a surface of the material. A molding is produced from a material and a fluoropolymer-containing compound is produced at a surface of the molding by a vapor deposition.
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Brunnbauer Markus
Mahler Joachim
Mengel Manfred
Schilz Christof Matthias
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Zarneke David A
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