Method for producing a circuit module comprising at least...

Details Method for producing a circuit module comprising at least... Method for producing a circuit module comprising at least...

2007-09-12

2010-12-21

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S773000, C257S777000, C257S784000, C257SE23024, C257SE23169, C438S666000, C438S109000, C438S617000

Reexamination Certificate

active

07855463

ABSTRACT:
An integrated circuit module comprises a chip, the chip comprising a substrate with a first main area and a second main area, the first main area comprising two half-sets of pads, the chip further comprising an integrated circuit with components and two half-sets of connection lines, the connection lines connecting the components of the integrated circuit to the pads, the integrated circuit further comprising a changeover device, the changeover device having two switching states in order to interchange the electrical assignment between the half-sets of the connection lines and the half-sets of the pads, and a carrier, the carrier comprising contact pieces. The chip is arranged on the carrier with one of the two main areas of the chip facing the carrier and the contact pieces of the carrier are connected to the pads of the chip, wherein one of the two switching states of the changeover device is selected, depending on which of the two main areas of the chip is the area facing the carrier.

REFERENCES:
patent: 4959704 (1990-09-01), Isomura et al.
patent: 5103282 (1992-04-01), Isomura et al.
patent: 6355980 (2002-03-01), Callahan
patent: 6599764 (2003-07-01), Ang et al.
patent: 6617196 (2003-09-01), Iwaya et al.
patent: 6667895 (2003-12-01), Jang et al.
patent: 2002/0041015 (2002-04-01), Kodaira et al.
patent: 10258722 (2003-06-01), None

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