Method for processing semiconductor wafer with reduced particle

Details Method for processing semiconductor wafer with reduced particle Method for processing semiconductor wafer with reduced particle

1995-08-23

1997-09-16

Breneman, R. Bruce

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

H01L 2100

Patent

active

056680627

ABSTRACT:
A method of processing a semiconductor wafer (12) to form micromechanical devices. Extended scribe lines (20) are provided from centrally located integrated circuit scribe lines (16) to provide a saw street that extends to the perimeter of the wafer. Micromechanical devices (14), including those of the DMD type, can be fabricated without a layer of protective oxide while reducing the generation of conductive particles during the wafer saw process which could otherwise degrade the operation of the micromechanical devices having movable elements. The extended scribe lines (20) are fabricated at the same time that the conventional scribe lines (16) are formed about the integrated circuits (14).

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