Method for processing and measuring rotationally symmetric...

Details Method for processing and measuring rotationally symmetric... Method for processing and measuring rotationally symmetric...

2007-01-09

2007-01-09

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S041000, C451S285000, C125S013030, C051S302000

Reexamination Certificate

active

11141959

ABSTRACT:
A method for processing a rotationally symmetric workpiece, preferably having optically effective surfaces, whose symmetry axis is aligned parallel with the z-axis and which is moveable parallel with the z-axis, using a rotating, rotationally symmetric grinding or polishing tool whose rotation axis is aligned parallel with the y-axis and which is thereby touching the surface of the workpiece by means of a processing surface, the workpiece rotating around its symmetry axis and to a tool for performing said method as well as a method for tactile measuring of such a workpiece. The invention may be used for processing aspheric workpieces having optically effective surfaces, in particular lenses or mirrors that have a non-processable zone, for example a conical bump in the middle of the workpiece.

REFERENCES:
patent: 4794736 (1989-01-01), Fuwa et al.
patent: 5289660 (1994-03-01), Terasaki et al.
patent: 5379510 (1995-01-01), Berge
patent: 5532932 (1996-07-01), Niwa
patent: 5914876 (1999-06-01), Hirai

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