Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With heating or cooling means for apparatus part other than...
Reexamination Certificate
2005-03-22
2005-03-22
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With heating or cooling means for apparatus part other than...
C156S345520, C156S345530, C118S724000
Reexamination Certificate
active
06869500
ABSTRACT:
Disclosed are a method and an apparatus for processing a wafer in manufacturing a semiconductor device and a method and an apparatus for etching a material formed on the wafer, wherein first and second cooling parts adjust an ambient temperature near a plurality of wafers to a first temperature, the wafers are processed by introducing a reaction gas at the first temperature, then, a heating part rapidly raises the temperature of the atmosphere near the wafers from the first temperature to the second temperature to partially separate by-products produced during the processing, the second temperature is maintained to separate most of the by-products from the wafers, and the processing steps are implemented in-situ within the same space. Accordingly, a native oxide layer formed on several wafers can be etched and the reaction by-products can be removed in-situ in the same chamber so productivity is improved.
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An Jae-Hyuk
Chae Seung-Ki
Kim Jea-Wook
Lee Kwang-Myung
Takagi Mikio
Hassanzadeh Parviz
Lee, Sterba & Morse P.C.
Samsung Electronics Co,. Ltd.
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