Method for processing a three-dimensional structure by laser

Details Method for processing a three-dimensional structure by laser Method for processing a three-dimensional structure by laser

2005-09-27

2005-09-27

Tentoni, Leo B. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

C219S121690, C219S121720, C219S121850, C264S139000, C264S482000

Reexamination Certificate

active

06949215

ABSTRACT:
A laser processing method capable of performing fine and highly accurate processing by low energy is obtained.The invention relates to the laser processing method where laser beam for processing (4) is irradiated on a processing object (2) and the laser beam for processing (4) directly removes a part of the processing object (2). The processing object (2) is made of a glass substrate, metal thin film (3) having high absorption to laser beam for processing (4) is formed on a surface of glass substrate, into which laser beam for processing (4) is made incident, the laser beam for processing (4) is irradiated from a surface of metal thin film (3), and matter is directly removed by irradiation of laser beam onto the processing object (2) in order to form a region finer than an irradiation region of laser beam for processing (4) on the processing object (2).

REFERENCES:
patent: 5656229 (1997-08-01), Tanimoto et al.
patent: 56160893 (1981-12-01), None
K. Midorikawa, O plus E, vol. 21, No. 9, pp. 1130-1136, “Femtosecond Laser Material Processing”, Sep. 1999 (with English translation).
H. Kumagai, Applied Physics, vol. 67, No. 9, pp. 1051-1055, “Femtosecond Laser Material Processing”, Sep. 1998 (with partial English translation).
B. N. Chichkov, et al., Applied Physics A, vol. 63, pp. 109-115, “Femtosecond, Picosecond and Nanosecond Laser Ablation of Solids”, 1996.

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