Method for probing a semiconductor wafer

Details Method for probing a semiconductor wafer Method for probing a semiconductor wafer

1994-05-02

1996-07-09

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324761, 324762, 324755, G01R 3102

Patent

active

055347843

ABSTRACT:
A method for probing a semiconductor wafer utilizes an array probe assembly (60) which includes a production package substrate (64). Substrate (64) is used to transform a configuration of conductive pads (74) on a probe card (62) into a configuration which matches that of conductive bumps (54) on a semiconductor die (52). Array probe assembly (60) may also include an array probe head (68) having probe wires (84) for coupling conductive pads (80) on substrate (64) with conductive bumps (54) on die (52). After probing the die, the die are assembled into a final packaged semiconductor device (110) which includes a substrate (90) which is nearly identical to the substrate used in the array probe assembly. Use of a production package substrate in the array probe assembly reduces the cost of the array probe assembly, and results in more accurate testing since the substrate in the array probe assembly will emulate the performance of the die in the final packaged device.

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Fisher, et al.; "Reducing Test Costs for High-Speed and High Pin-Count Devices;" Evaluation Engineering, Feb. 1992; pp. 96-101.
Motorola; "C4 Product Design Manual;" vol. 1: Chip and Wafer Design; ch. 1 Technology Overview, pp. 1-1--20 and ch. 9 Wafer probing, pp. 9-1--14 (1993).

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