Method for printing etch masks using phase-change materials

Details Method for printing etch masks using phase-change materials Method for printing etch masks using phase-change materials

2005-03-29

2005-03-29

Norton, Nadine G. (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S041000, C216S042000, C216S044000

Reexamination Certificate

active

06872320

ABSTRACT:
A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

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