Method for printed circuit board and/or printed wiring board cle

Cleaning and liquid contact with solids – Processes – Oils – grease – tar – or wax removal – by dissolving

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134 42, C23G 100

Patent

active

046407197

ABSTRACT:
Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.

REFERENCES:
patent: 4246147 (1981-01-01), Bakos et al.
patent: 4276186 (1981-06-01), Bakos et al.
patent: 4294729 (1981-10-01), Bakos et al.
patent: 4369287 (1983-01-01), Hutchinson et al.
patent: 4373974 (1983-02-01), Barajas
patent: 4434084 (1984-02-01), Hicks et al.
patent: 4511488 (1985-04-01), Matta

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