Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2005-09-20
2005-09-20
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S780000, C438S781000, C427S240000, C427S384000, C427S385500
Reexamination Certificate
active
06946407
ABSTRACT:
A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
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Davlin John T.
Mitson Lorna M.
Schramm Douglas S.
Ghyka Alexander
Micro)n Technology, Inc.
Mueting Raasch & Gebhardt, P.A.
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