Method for prescribed, structured deposition of micro-structures

Details Method for prescribed, structured deposition of micro-structures Method for prescribed, structured deposition of micro-structures

1988-08-31

1989-08-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156664, 427 531, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

048592790

ABSTRACT:
An improvement of a method for structured LCVD deposition onto, in particular, non-homogenous material of a substrate member, wherein a metal film of, in particular, tungsten that has a leveling effect with respect to reflectivity and/or lateral heat propagation is provided on a substrate surface before the deposition.

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patent: 3801366 (1974-04-01), Lemelson
patent: 4543270 (1985-09-01), Oprysko et al.
patent: 4626315 (1986-12-01), Kitamoto et al.
patent: 4748045 (1988-05-01), Ehrlich et al.
"Progress in LPCVD Tungsten for Advanced Microelectronics Applications", Blewer, Solid State Technology/Nov. 1986, pp. 117-126.
"Laser-Direct-Writing Processes: Metal Deposition, Etching, and Applications to Microcircuits", Black et al., 1987, American Vacuum Society, J. Vac. Sci. Technol. B 5 (1), Jan./Feb. 1987, pp. 419-422.
"Photodeposition of Aluminum Oxide and Aluminum Thin Films", Solanki et al., 1983 American Institute of Physics, Appl. Phys. Lett., 43 (5), Sep. 1, 1983, pp. 454-456.
"Localized Laser Chemical Processing of Tungsten Films", Grossman et al., 1987 American Vacuum Society, J. Vac. Sci. Technol. B 5 (4), Jul./Aug. 1987, pp. 843-847.
"Chemical Process with Lasers", Springer Series in Materials Science Bd. 7, pp. 86-106.

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