Method for preparing thin copper foil-clad substrate for circuit

Details Method for preparing thin copper foil-clad substrate for circuit Method for preparing thin copper foil-clad substrate for circuit

1989-05-19

1990-04-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156645, 156651, 156656, 156666, 156902, 252 792, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

049177583

ABSTRACT:
A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper foil having an average thickness of 12 .mu.m or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness, and the variation of the thickness of the copper foil remaining after the etching is within .+-.2.0 .mu.m on the basis of a desired thickness.

REFERENCES:
patent: 3231503 (1966-01-01), Laue
patent: 3671407 (1972-06-01), Hamiton et al.
patent: 4434022 (1984-02-01), Kamada et al.
patent: 4790902 (1988-12-01), Wada et al.

Affiliated with

Also associated with

Rating

Method for preparing thin copper foil-clad substrate for circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing thin copper foil-clad substrate for circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing thin copper foil-clad substrate for circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1050342