Method for preparing porous material using nanostructures...

Details Method for preparing porous material using nanostructures... Method for preparing porous material using nanostructures...

2006-05-31

2010-02-16

Culbert, Roberts (Department: 1792)

Etching a substrate: processes

Etching to produce porous or perforated article

C427S249100

Reexamination Certificate

active

07662300

ABSTRACT:
Disclosed herein is a method for preparing a porous material using nanostructures. The method comprises the steps of producing nanostructures using a porous template, dispersing the nanostructures in a source or precursor material for the porous material, aligning the nanostructures in a particular direction, and removing the nanostructures by etching. According to the method, the size, shape, orientation and regularity of pores of the porous material can be easily controlled, and the preparation of the porous material is simplified, leading to a reduction in preparation costs.Further disclosed is a porous material prepared by the method.

REFERENCES:
patent: 6129901 (2000-10-01), Moskovits et al.
patent: 6312303 (2001-11-01), Yaniv et al.
patent: 7422696 (2008-09-01), Mirkin et al.
patent: 2004/0169007 (2004-09-01), Sander et al.
Huang, Y., et al., “Directed Assembly of One-Dimensional Nanostructures Into Functional Networks,” Science, vol. 291, pp. 630-633 (2001).
Shchukin, D., et al., “Template Synthesis and Photocatalytic Properties of Porous Metal Oxide Spheres Formed by Nanoparticle Infiltration,” Chem. Mater., vol. 16, pp. 2287-2292 (2004).

Affiliated with

Also associated with

Rating

Method for preparing porous material using nanostructures... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing porous material using nanostructures..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing porous material using nanostructures... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4183447