Method for preparing a printed circuit board

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29852, 156656, 156666, 156902, 156904, 204 141, 427 97, 430313, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046734589

ABSTRACT:
The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.

REFERENCES:
patent: 4327167 (1982-04-01), Tanabe
patent: 4608274 (1986-08-01), Wooten

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for preparing a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing a printed circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-682263

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.