Method for preparing a printed circuit board

Details Method for preparing a printed circuit board Method for preparing a printed circuit board

1988-11-16

1989-11-07

Powell, Willaim A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156656, 156666, 156902, 156904, 204 141, 427 97, 430313, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

RE0331082

ABSTRACT:
The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.

REFERENCES:
patent: 4327167 (1982-04-01), Tanabe
patent: 4608274 (1986-08-01), Wooten
patent: 4770900 (1988-09-01), Seibel

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