Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-10-03
1986-07-08
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29576W, 29580, 29591, 156646, 156648, 156653, 156655, 156657, 1566591, 156662, 156668, 204192EC, 204192E, 357 49, 357 65, 427 93, 427 94, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
045991367
ABSTRACT:
A method of fabrication of semiconductor structures which utilize trenches filled with polymeric dielectric materials to isolate segments thereof is disclosed. Contamination of the polymeric dielectric during processing of structural segments is avoided by filling the trenches with disposable polymer through formation of conductive patterns upon the structure, with subsequent removal of the disposable polymer and replacement with the desired polymeric dielectric.
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Araps Constance J.
Kandetzke Steven M.
Kutner Ellen L.
Takacs Mark A.
International Business Machines - Corporation
Moore Shirley Church
Powell William A.
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