Method for preparation of a photosensor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

29572, 156646, 156652, 156656, 156657, 1566591, 156662, 204192E, 427 38, 252 791, C23F 102, H01L 21306

Patent

active

045810990

ABSTRACT:
A method for preparing a photosensor having electrodes formed on a photoconductive layer through an intermediary ohmic contact layer is provided which comprises forming an ohmic contact layer on a photoconductive layer, forming electrodes with a desired shape on the ohmic contact layer, then removing the ohmic contact layer at the exposed portion for photoelectric transducing by the etching method and thereafter applying heat treatment, thereby forming a photosensor array.

REFERENCES:
patent: 4069095 (1978-01-01), Lorenze et al.
patent: 4281208 (1981-07-01), Kuwano et al.
patent: 4366229 (1982-12-01), Freeman
patent: 4390394 (1983-06-01), Mathuni et al.

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