Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2001-07-03
2008-03-11
Kackar, Ram N. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345250, C156S345260, C118S712000, C204S192100, C204S298010
Reexamination Certificate
active
07341644
ABSTRACT:
There is not known a conventional method for predicting the consumed degree of consumable supplies and the thickness of deposited films without opening a processing chamber.A method for predicting the consumed degree of a consumable supply and the thickness of a deposited film according to the present invention is used for a plasma processing system10for carrying out a predetermined processing for a wafer W with plasma which is produced from a process gas by applying a high-frequency power, and comprises the steps of: measuring the voltages and currents of a fundamental wave and its integer-times waves of a high-frequency power supply20, which vary in accordance with the thickness of a focus ring21and the thickness of a deposited film, with elapsed time; and using these measured data to carry out a multiple regression analysis to predict the thickness of the focus ring21and the thickness of the deposited film.
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PCT Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report (PCT/IB/338) issued for PCT/JP01/05755.
International Preliminary Examination Report (PCT/IPEA/409) (translated) issued for PCT/JP01/05755.
Sakano Shinji
Sendoda Tsuyoshi
Kackar Ram N.
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
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