Method for predetermining peel strength at copper/aluminum inter

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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134 1, 156629, 156643, 156665, 156235, 156249, 156344, 427309, B44C 100

Patent

active

044526644

ABSTRACT:
A low temperature (about 0.degree. C. to about 100.degree. C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.

REFERENCES:
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 4282266 (1981-08-01), Fisher
patent: 4354895 (1982-10-01), Ellis
patent: 4372804 (1983-02-01), Hanabusa et al.

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