Method for polishing the top and bottom of a semiconductor wafer

Details Method for polishing the top and bottom of a semiconductor wafer Method for polishing the top and bottom of a semiconductor wafer

1997-04-10

1999-02-23

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 63, 451262, 451267, 451269, B24B 100, B24B 722

Patent

active

058737723

ABSTRACT:
A method for polishing a semiconductor wafer is provided. A semiconductor wafer is detached from a polishing pad on a side of an upper polishing plate and is kept to be supported by a lower polishing plate. A contact area between the a wafer and the upper polishing plate is set to be less than a contact area between the wafer and the lower polishing plate. As a result, the wafer is definitely detached from the polishing pad on the side of the upper polishing plate and is to be kept supported by the lower polishing plate when the upper polishing plate is lifted.

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patent: 4773185 (1988-09-01), Taira
patent: 5099614 (1992-03-01), Arai et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5394655 (1995-03-01), Allen et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5725420 (1998-03-01), Torii

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