Method for polishing AlGaAs surfaces

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156639, 156654, 156662, 156903, 252 795, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

048895865

ABSTRACT:
The present invention polishes the surface of a substrate or epitaxial layer of Al.sub.x Ga.sub.1-x As wherein 0<x<1.0 with a polishing liquid comprising an aqueous alkali hypochlorite solution or a mixture of said aqueous solution with an alkali carbonate, said liquid being regulated to a pH value ranging from 8.0 to 11.0, and further containing a powder such as SiO.sub.2 or a colloidal material such as colloidal silica having a fine particle size to afford a planar mirror-surface to said surface, thereby preventing wafer cracking or pattern flowing during patterning by photomasks and improving yields.

REFERENCES:
patent: 3738882 (1973-06-01), Basi
patent: 3869324 (1975-03-01), Basi et al.
patent: 4448634 (1984-05-01), Lampert
patent: 4732648 (1988-03-01), Fronius et al.

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