Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-03-30
1989-12-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156639, 156654, 156662, 156903, 252 795, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
048895865
ABSTRACT:
The present invention polishes the surface of a substrate or epitaxial layer of Al.sub.x Ga.sub.1-x As wherein 0<x<1.0 with a polishing liquid comprising an aqueous alkali hypochlorite solution or a mixture of said aqueous solution with an alkali carbonate, said liquid being regulated to a pH value ranging from 8.0 to 11.0, and further containing a powder such as SiO.sub.2 or a colloidal material such as colloidal silica having a fine particle size to afford a planar mirror-surface to said surface, thereby preventing wafer cracking or pattern flowing during patterning by photomasks and improving yields.
REFERENCES:
patent: 3738882 (1973-06-01), Basi
patent: 3869324 (1975-03-01), Basi et al.
patent: 4448634 (1984-05-01), Lampert
patent: 4732648 (1988-03-01), Fronius et al.
Noguchi Masahiro
Yamamoto Osamu
Mitsubishi Kasei Corporation
Mitsubishi MonsantoChemical Company
Powell William A.
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