Method for polishing a semiconductor substrate

Details Method for polishing a semiconductor substrate Method for polishing a semiconductor substrate

1995-07-31

1997-07-01

Chea, Thorl

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566531, 1566571, 437225, 437228, 437946, H01L 21302

Patent

active

056434057

ABSTRACT:
An improved method for polishing a semiconductor substrate includes forming a protective layer (21) on one major surface (24) of a substrate (19) to form a protected side and polishing an unprotected surface (26) of the substrate (19) with a double sided polisher (11). During the polishing process, material from the unprotected side (26) is removed at a faster rate than material from the protected side. The method provides a single side polished substrate (19) with improved flatness characteristics. In an additional embodiment, polishing pads (13,23) having different surface contact characteristics are used to support process automation.

REFERENCES:
patent: 5389579 (1995-02-01), Wells

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