Method for plating polyamide resin molded article

Details Method for plating polyamide resin molded article Method for plating polyamide resin molded article

1984-11-14

1986-01-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 252 792, 252 794, 427307, B29C 1708, B44C 122, C03C 1500, C03C 2506

Patent

active

045632421

ABSTRACT:
A method for plating a polyamide resin molded article which comprises carrying out, before plating treatment, etching treatments, namely the first etching treatment with an aqueous stannic chloride solution and then the second etching treatment with an aqueous acid solution, and brings about a plating effect excellent in strength of adhesion of plating film and in plating appearance.

REFERENCES:
patent: 3235426 (1966-02-01), Bruner
patent: 4315045 (1982-02-01), Dillard et al.

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