Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-09-09
1998-08-04
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29840, 257712, 257713, H05K 330
Patent
active
057875758
ABSTRACT:
A method for plating an integrated circuit package. The method includes constructing a package which has a plurality of internal bond fingers that are subsequently coupled to an integrated circuit. The package contains a plurality of vias that are electrically connected to the bond fingers. The vias are also coupled to a layer of metallization that extends across an outer surface of the package. The meallization layer is used as a plating bar to plate the internal bond fingers. After plating the meallization layer is etched from the surface of the package.
REFERENCES:
patent: 4296456 (1981-10-01), Reid
patent: 4879508 (1989-11-01), Ohtsuka et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5225709 (1993-07-01), Nishiuma et al.
patent: 5409863 (1995-04-01), Newman
patent: 5468999 (1995-11-01), Lin et al.
patent: 5491362 (1996-02-01), Hamzehdoost
patent: 5557502 (1996-09-01), Banerjee et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5621190 (1997-04-01), Yamasaki et al.
patent: 5625225 (1997-04-01), Huang et al.
patent: 5650662 (1997-07-01), Edwards et al.
Banerjee Koushik
Chroneos, Jr. Robert J.
Mozdzen Tom
Arbes Carl J.
Intel Corporation
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