Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-04-24
1993-08-17
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 1566591, 156664, 437245, B44C 122, C23F 100
Patent
active
052365506
ABSTRACT:
The present invention provides a process for patterning ruthenium. A layer of ruthenium is formed on a substrate. The ruthenium is masked. The ruthenium is exposed to an oxygen plasma.
Abt Norman E.
Shepherd William H.
National Semiconductor Corporation
Powell William A.
LandOfFree
Method for plasma etch of ruthenium does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for plasma etch of ruthenium, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for plasma etch of ruthenium will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2241328