Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1985-10-21
1987-06-09
Smith, John D.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
427 82, 427 88, 427240, 430329, H01L 21312
Patent
active
046720235
ABSTRACT:
A method for filling indentations to planarize the surface of a wafer is disclosed. The method includes three steps: (1) coating the wafer surface with a layer of positive photoresist that fills the indentations and covers the surface of the wafer; (2) exposing the layer of photoresist to light or other radiation source of such intensity and duration that the layer of photoresist is exposed down to the surface of the wafer but not into the indentations; and (3) removing the exposed portion of the photoresist by using a developer, resulting in a planarized wafer containing indentations filled with unexposed photoresist. Once the wafer has been planarized by this method, overstructures can be formed over the top of the photoresist filled indentations.
REFERENCES:
patent: 3976524 (1976-08-01), Feng
patent: 4025411 (1977-05-01), Hom-Ma
patent: 4379833 (1983-04-01), Canavello
patent: 4427713 (1984-01-01), White
Avantek, Inc.
Smith John D.
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