Fishing – trapping – and vermin destroying
Patent
1992-05-27
1993-08-10
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437946, 437974, 156636, 156637, H01L 21302, H01L 21463
Patent
active
052348679
ABSTRACT:
An apparatus for planarizing semiconductor wafers in its preferred form includes a rotatable platen for polishing a surface of the semiconductor wafer and a motor for rotating the platen. A non-circular pad is mounted atop the platen to engage and polish the surface of the semiconductor wafer. A polishing head holds the surface of the semiconductor wafer in juxtaposition relative to the non-circular pad. A polishing head displacement mechanism moves the polishing head and semiconductor wafer across and past a peripheral edge of the non-circular pad to effectuate a uniform polish of the semiconductor wafer surface. Also disclosed is a method for planarizing a semiconductor surface using a non-circular polishing pad.
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Doan Trung T.
Schultz Laurence D.
Tuttle Mark E.
Chaudhuri Olik
Micro)n Technology, Inc.
Tsai H. Jey
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